Electronic components need to be protected against moisture, chemical exposure and high temperatures, but standard production cycles with bonding and encapsulation takes time and have design limitation.
TECHNOMELT® and LOCTITE® low pressure molding material solutions from Henkel offer streamlined processing and excellent protection for Medical, Electronic Components, Power & Industrial Automation, HVAC and Lighting applications.LOCTITE® low pressure molding materials have been tested to Henkel’s protocols based upon ISO-10993 biocompatibility standards, with certificates available on request. The simplicity of these products is their advantage: the entire Henkel operation takes place at low pressure, cycle time is short, and fine or fragile circuitry is not damaged. For these reasons, TECHNOMELT® and LOCTITE® are increasingly being chosen as an alternatives to encapsulating processes (e.g. potting) as well as conventional plastic housings.
Whether you are looking for polyamide or polyolefin hot melt adhesives, Henkel materials deliver exceptional electrical insulation, as well as temperature, vibration, and solvent resistance for modern connectors, electronic components, printed circuit boards (PCBs), lighting and medical applications. The broad product range protects electronics from the harshest environmental conditions, including high humidity, long-term UV exposure, and extreme thermal cycling. Henkel is a trusted supplier of high-quality low pressure molding materials that help protect electronic circuit boards and other components against various environmental pressures.
Contact us today to talk to our team of experts about our entire line of low pressure molding materials.
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